thermal-oxidation curing
基本解释
- [機械工程]熱氧化交聯
英汉例句
- During the integrated circuit packing process, the quality and service life of integrated circuit are decided directly by the quality of conductive adhesive through non-oxidation thermal curing.
在集成電路封裝工藝過程中，對導電膠進行無氧化加熱固化的質量直接決定了集成電路的質量和使用壽命。
雙語例句
专业释义
- 熱氧化交聯